cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 1/6 MSR0860AJ3 cystek product specification 8amp. superfast high voltage rectifiers i f(av) 8a v rrm MSR0860AJ3 600v features ? 175 operating junction temperature ? low leakage current ? superfast recovery time ? low switching loss, high efficiency ? high forward surge capability ? pb-free lead plating and halogen-free package mechanical data ? case: to-252 molded plastic ? mounting position: any ? terminals: pure tin plated, sold erable per j-std-002 and jesd22-b102 ? epoxy: ul 94v-0 rate flame retardant ? polarity : as marked. equivalent circuit outline MSR0860AJ3 to-252(dpak) i fsm 125a trr 25ns tj 175 c v f(max) 2.2v a k a
cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 2/6 MSR0860AJ3 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 600 v maximum rms voltage v rms 420 v maximum dc blocking voltage v dc 600 v t c =25 c 1.8 2.2 maximum instantaneous forward voltage at i f =8a t c =125 c v f 1.5 2 v maximum average forward rectified current @ t c =100 i f(av) 8 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 125 a v r =600 v, t c =25 25 maximum instantaneous reverse current at v r =600 v, t c =125 i r 500 a maximum reverse recovery time i f =1a, v r =30v, di f /dt=100a/ s trr 16 25 ns typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 18 pf storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 4 maximum thermal resistance, junction-to-ambient (note 1) 50 maximum thermal resistance, junction-to-ambient (note 2) r th,j-a 110 c/w note : 1. when device mounted on 1 in 2 fr-4 board with 2 oz. copper, in a still air environment with t a =25 c. 2. when mounted on th e minimum pad size recommended (pcb mount). ordering information device package shipping MSR0860AJ3-0-t3-g to-252 (pb-free lead plating an d halogen-free package) 2500 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t3 : 2500 pc s / tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 3/6 MSR0860AJ3 cystek product specification typical characteristics forward current derating curve 0 1 2 3 4 5 6 7 8 9 0 25 50 75 100 125 150 175 200 case temperature---t c () average forward current---i f(av) (a) resistive or inductive load forward current vs forward voltage 1 10 100 1000 10000 0 0.4 0.8 1.2 1.6 2 2.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=125 tj=75c reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 100 200 300 400 500 600 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 junction capacitance vs reverse voltage 1 10 100 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz recommended soldering footprint
cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 4/6 MSR0860AJ3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 5/6 MSR0860AJ3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c191j3 issued date : 2013.12.12 revised date : 2013.12.20 page no. : 6/6 MSR0860AJ3 cystek product specification to-252 dimension *: typical inches marking: style: pin 1.anode 2.cathode 3.anode 3-lead to-252 plastic surface mount package cystek package code: j3 msr 0860a millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 a1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 b 0.039 0.048 0.990 1.210 h 0.163 ref 4.140 ref b 0.026 0.034 0.660 0.860 k 0.190 ref 4.830 ref b1 0.026 0.034 0.660 0.860 l 0.386 0.409 9.800 10.400 c 0.018 0.023 0.460 0.580 l1 0.114 ref 2.900 ref c1 0.018 0.023 0.460 0.580 l2 0.055 0.067 1.400 1.700 d 0.256 0.264 6.500 6.700 l3 0.024 0.039 0.600 1.000 d1 0.201 0.215 5.100 5.460 p 0.030 ref 0.750 ref e 0.236 0.244 6.000 6.200 v 0.211 ref 5.350 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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